Overview
300mm wafer edge-grip aligner robot for semiconductor manufacturing without back-side contact.
Detailed specifications
Other8
- Extras
- {"grip_type":"edge_grip","wafer_size":"300mm"}
- Datasheet Url
- View Link
- Specs Sources
- View Link
- Price On Request
- true
- Specs Source Url
- Preview PDF online
- Specs Source Pass
- phase_d_detect_enrich
- Availability Status
- available
- Additional Information
- - Edge-grip design prevents contact with wafer backside, reducing contamination risk - Designed for 300mm wafers in semiconductor cleanroom environments - Part of Daihen's ACTRANS clean transfer robot series - Supported by global service network including overseas offices for semiconductor equipment
Reviews for ACTRANS EG-303 シリーズ
Loading reviews…